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May 2006

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Subject:
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Mon, 15 May 2006 08:46:46 -0500
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text/plain (167 lines)
Vladimir/Brent
Of course. Many people have been using ENIG, for years, with good results.

The ability to use it without problems depends on:
Type of board design and layout (use of BGAs and CSPs)
Use of Heatsink, board stiffeners, etc.
Number of layers, copper distribution, CTE issues, etc.
Ability of vendor to control their ENIG plating process, and plating materials
Product Life requirements
Product use environment
Knowledge and control of optimum process settings and materials

and many other variables. There are relatively benign applications where ENIG can do well.

But once again, why should I use ENIG with its higher cost and well-documented and potentially catastrophic reliability issues instead of immersion silver or some other finish that typically provides a stronger, more reliable connection? 
No one has addressed that question yet with a good answer. 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Alcorn, Brent
Sent: Monday, May 15, 2006 8:14 AM
To: [log in to unmask]
Subject: Re: [TN] Question about ENIG in SnPb process . . . .

I agree Vladimir,

We have been using ENIG for a number of years without any "Black Pad" issues.  


Regards,
Brent



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Vladimir Igoshev
Sent: Friday, May 12, 2006 11:21 AM
To: [log in to unmask]
Subject: Re: [TN] Question about ENIG in SnPb process . . . .

I wish we stopped "scarring" people off with "Black Pad" thing. I'm yet to be convinced it's a problem NOW and I don't believe I'm alone.


Regards,

Vladimir


Vladimir Igoshev, Ph.D.
Manager, Metallurgical Lab
451 Phillip St.
Waterloo, ON N2L 3X2
Voice: (+1) 519 888-7465 x 5283
Cell:  (+1) 519 572-9261
Fax:   (+1) 519 888-6751
Email:  [log in to unmask] 



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Lee parker
Sent: May 12, 2006 10:29 AM
To: [log in to unmask]
Subject: Re: [TN] Question about ENIG in SnPb process . . . .

Gerard

Werner has offered some advice that we all should use to our advantage; go to Google and and search for "black pad". For a PCB defect to have its own web page reaches the stratosphere of notoriety.

Staying within the manufacture's processing window will usually produce acceptable product; unfortunately small excursions beyond this window usually results in soldering problems, black pad or black pad like issues.
Unfortunately, judging by the notoriety of ENIG this occurs far too often.

Writing specs does not in itself create a robust process.

Best regards

Lee

J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389


----- Original Message -----
From: "Gerard O'Brien" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, May 12, 2006 8:30 AM
Subject: Re: [TN] Question about ENIG in SnPb process . . . .


Camille - first of all, refer to IPC4552 which is the ENIG spec, purchase boards from suppliers following this spec and you shall have no issues.
Please be aware that reflow temperatures need to be increased slightly, 220C minimum to ensure a good solder joint formation, due to the relatively slower wetting of nickel.
Werner - please, enough with the black pad already, the world is using ENIG somewhere between 7 to 10% as the surface of choice. The old adage of you get what you pay for applies as does buyer beware - if you buy from a schlock house you will have not only solderability issues but other less obvious defects as well.

Regards


Gerard O'Brien
Photocircuits Corporation
Co-chair 4-14 plating committee.

-----Original Message-----
From: Camille Good [mailto:[log in to unmask]]
Sent: Thursday, May 11, 2006 7:28 PM
To: [log in to unmask]
Subject: [TN] Question about ENIG in SnPb process . . . .

Has anyone run into problems using PCBs with ENIG finish in regular SnPb IR reflow or wave solder processes?

  I just talked to someone who said that there were industry advisories out from a couple of companies (maybe Intel & Radisys??) advising against that mixture of solder & surface finish, but I have not heard anything about that on either the TechNet or Lead-Free discussion groups, and a Google search for "SnPb solder ENIG finish" didn't turn up any immediate warnings either.

  Many thanks in advance for any information,
  -Camille Good
  Portland, Oreong


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