整天看英文的，给大家整点中文看看，呵呵
----- Original Message -----
From: "Vladimir Igoshev" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, May 12, 2006 9:40 AM
Subject: (瑞星提示-此邮件可能是垃圾邮件)Re: [TN] Question about ENIG in SnPb process . . . .
If your product will be subjected to an impact tpe of load, then it's better not to use ENIG, otherwise, you might see "Brittle Fracture" type of failure at the solder/board interface.
Vladimir
RIM
Sent from my Blackberry Wireless
Vladimir Igoshev, 519-888-7465 ext.5283
----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Thu May 11 20:27:31 2006
Subject: [TN] Question about ENIG in SnPb process . . . .
Has anyone run into problems using PCBs with ENIG finish in regular SnPb IR reflow or wave solder processes?
I just talked to someone who said that there were industry advisories out from a couple of companies (maybe Intel & Radisys??) advising against that mixture of solder & surface finish, but I have not heard anything about that on either the TechNet or Lead-Free discussion groups, and a Google search for "SnPb solder ENIG finish" didn't turn up any immediate warnings either.
Many thanks in advance for any information,
-Camille Good
Portland, Oreong
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