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May 2006

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Subject:
From:
Vladimir Igoshev <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Vladimir Igoshev <[log in to unmask]>
Date:
Thu, 11 May 2006 21:40:01 -0400
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If your product will be subjected to an impact tpe of load, then it's better not to use ENIG, otherwise, you might see "Brittle Fracture" type of failure at the solder/board interface.

Vladimir

RIM
Sent from my Blackberry Wireless 
Vladimir Igoshev, 519-888-7465 ext.5283


----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Thu May 11 20:27:31 2006
Subject: [TN] Question about ENIG in SnPb process . . . .

Has anyone run into problems using PCBs with ENIG finish in regular SnPb IR reflow or wave solder processes?

  I just talked to someone who said that there were industry advisories out from a couple of companies (maybe Intel & Radisys??) advising against that mixture of solder & surface finish, but I have not heard anything about that on either the TechNet or Lead-Free discussion groups, and a Google search for "SnPb solder ENIG finish" didn't turn up any immediate warnings either.

  Many thanks in advance for any information,
  -Camille Good
  Portland, Oreong


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