TECHNET Archives

May 2006

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Marsico, James" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Marsico, James
Date:
Wed, 10 May 2006 09:10:46 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (28 lines)
Hello Technet,

We're seeing a recurring problem of a cracked ceramic IC, assembled on a
through-hole PWB.  The component is an 8-pin DIP, T.I. P/N 5962-9452601QPA .
The crack is located below the lead frame and radiates all the way around
the device.  Has anyone experienced this before?

Please respond directly to me, as I cannot receive e-mails from Technet.

Thanks in advance,

Jim Marsico
Senior Engineer
Production Engineering
EDO Corporation
[log in to unmask] <mailto:[log in to unmask]>
631-630-5079

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2