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May 2006

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Subject:
From:
"Dehoyos, Ramon" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Dehoyos, Ramon
Date:
Mon, 8 May 2006 11:46:45 -0400
Content-Type:
text/plain
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text/plain (85 lines)
        Good article David:
http://www.speedlinetechnologies.com/docs/Frank-Grano_SMTA2004.pdf
        Regards,
        Ramon
 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David Tremmel
Sent: Monday, May 08, 2006 10:16 AM
To: [log in to unmask]
Subject: Re: [TN] Intrusive Reflow

Hello,

Would anyone care to define what an intrusive reflow is?

TIA,

David

>From: Yannick Brisson <[log in to unmask]>
>Reply-To: TechNet E-Mail Forum <[log in to unmask]>,              Yannick
>Brisson <[log in to unmask]>
>To: [log in to unmask]
>Subject: [TN] Intrusive Reflow
>Date: Mon, 8 May 2006 09:04:05 -0400
>
>Hi,
>
>         Does anyone have tried intrusive reflow with any king of lead 
>free material??  I'd like to have your input on that topic.  I'm 
>wondering if the sames rules applied to SnPb and Lead Free? Do you know

>if it is better with a Tin , Silver or Gold plating? Do we need to have

>more paste applied to the board to met the IPC standard?
>
>Thank you
>
>Yannick
>
>
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