Intrusive reflow is a process where solder paste is printed on the thru holes, the thru hole components are inserted and the whole assembly is then reflowed. The printed solder wicks in the PTH and forms top side and bottom side fillets. Here, both the SMT and TH components are processed at the same time. It leads to time savings and savings in equipment (wave or selective soldering equipment is not needed).

Some issues are to be able to decide accurately how much solder volume is needed, having the space to overprint that solder volume on the PTHs and the TH components to be able to withstand reflow temperatures.

Amol Kane
M.S (Industrial Eng.)
Process Engineer
Harvard Custom Manufacturing 
941 Route 38  Owego, NY 13827
Phone: (607) 687-7669 x349
[log in to unmask]

 -----Original Message-----
From:   TechNet [mailto:[log in to unmask]]  On Behalf Of David Tremmel
Sent:   Monday, May 08, 2006 10:16 AM
To:     [log in to unmask]
Subject:        Re: [TN] Intrusive Reflow

Hello,

Would anyone care to define what an intrusive reflow is?

TIA,

David

>From: Yannick Brisson <[log in to unmask]>
>Reply-To: TechNet E-Mail Forum <[log in to unmask]>,              Yannick
>Brisson <[log in to unmask]>
>To: [log in to unmask]
>Subject: [TN] Intrusive Reflow
>Date: Mon, 8 May 2006 09:04:05 -0400
>
>Hi,
>
>         Does anyone have tried intrusive reflow with any king of lead free
>material??  I'd like to have your input on that topic.  I'm wondering if
>the sames rules applied to SnPb and Lead Free? Do you know if it is better
>with a Tin , Silver or Gold plating? Do we need to have more paste applied
>to the board to met the IPC standard?
>
>Thank you
>
>Yannick
>
>
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