We are working on a new Roadmap this summer and fall.   The activity this 
summer is focus meetings on various topics:
 
Two day technology update meetings on what is in the  Roadmap. Topics could 
include:
1. Advanced Electronics Packaging – 
2. Connector Technology and implementaion – 
3. Backplanes and Connectors – 
4. Factory Environment – 
5. Equipment roadmap for assembly – 
6. Flex Technology – 
7. Substrate Materials – 
8. Packaging Substrates – 
9. Optoelectronic Assembly – 
10. PCQRR Board Capability and Assembly –  

The first three meetings have been held, and I think the rest  are about 
scheduled through August.  By September we hope to have the basis  done.  We plan 
to publish by Expo/Apex in 2007.  Co-incidentally, the  iNEMI Roadmap is also 
on about the same schedule.  Their next coordination  meeting is May 17 (I 
think) at their office in Herndon, VA.  
 
Questions further - contact me off line. 
 
Denny Fritz
MacDermid, Inc
Editor - Board Fabrication Chapter IPC Roadmap

 
In a message dated 5/8/2006 9:20:08 AM Eastern Daylight Time,  
[log in to unmask] writes:

Any  ideas as to when the 2006/2007 IPC roadmap will be complete  and
published?

 

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