Werner,

   I am in need of your experience/expertise.   I am searching for
Solder Mask and/or gold finger plating Keep Out Zone criterion.  I have
been unable to locate any references.   Therefore, I turn to you.

What is the specification for maximum length/distance the paddle can be
plated with gold from the edge of the card?

My concerns are the integrity of:
   -  The copper trace integrity as it narrows from the paddle after
being      exposed to the gold plating process chemistry.
   -  The leaching of the copper barrel thickness by gold chemistry
process            and over plating with nickel and gold.
   -  The thin copper barrel and brittleness of a nickel layer within
the        copper barrel.
   -  Is the thin nickel layer able to withstand flexing.
   -  etc.

         
Victor, 
 <<Gold finger Keep out zone.jpg>> 

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