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Subject:	Re: Rohs Weeeeeee board material
From:	Happy Holden <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:	Tue, 30 May 2006 06:23:11 -0400
Content-Type:	text/plain
Parts/Attachments:	text/plain (72 lines)

Hi Susan,
We actually "Dip" the board, while the IPC has it as a "float".  I
inherited this process and am not sure which would be more severe.  We
also allow the board to cool before it is performed again.  Maybe someone
out there in [TN] can tell us which would be the better 'Method.
Happy Holden
Asian Pacific Services



Susan Mansilla <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
05/29/2006 05:13 PM
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Subject
Re: [TN] Rohs Weeeeeee board material






Hi Happy
I have a question regarding the step below

2. An initial qualifying order is built and some boards are sacrificed to
the 3X 288C-10 sec solder dip and well as simple coupons on the panel
border.  All are cross-sectioned and sent with the Qual Order.



Do you actually "dip" the samples in solder or do you perform IPC-TM-650,
2.6.8 which is Thermal Stress and is floating the sample on solder for the
same
time and at the same temp,

Susan Hott
Robisan Lab

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