Hi Susan,
We actually "Dip" the board, while the IPC has it as a "float". I
inherited this process and am not sure which would be more severe. We
also allow the board to cool before it is performed again. Maybe someone
out there in [TN] can tell us which would be the better 'Method.
Happy Holden
Asian Pacific Services
Susan Mansilla <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
05/29/2006 05:13 PM
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Re: [TN] Rohs Weeeeeee board material
Hi Happy
I have a question regarding the step below
2. An initial qualifying order is built and some boards are sacrificed to
the 3X 288C-10 sec solder dip and well as simple coupons on the panel
border. All are cross-sectioned and sent with the Qual Order.
Do you actually "dip" the samples in solder or do you perform IPC-TM-650,
2.6.8 which is Thermal Stress and is floating the sample on solder for the
same
time and at the same temp,
Susan Hott
Robisan Lab
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