How about a law that says no lead-free assemblies are allowed in the USA
after June 30 2006.
Jeffrey Bush
Director, Quality Assurance and Technical Support
VERMONT CIRCUITS INCORPORATED
76 Technology Drive - POB 1890
Brattleboro, Vermont 05302
Voice - 802.257.4571 ext 21
Fax - 802.257.0011
<http://www.vtcircuits.com/>
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Happy Holden
Sent: Friday, May 26, 2006 12:33 PM
To: [log in to unmask]
Subject: Re: [TN] Rohs Weeeeeee board material
Hi,
That's why we tell all our clients now to adjust their board blueprint
MFG
NOTES with the following additional statements:
1. That the finished multilayer must withstand (A)The LF assembly
process
description including a. Peak Temp b. Time at Peak Temp c Total
time above 250C on heating and cooling d. Number of Cycles of
a.+b.+c.
and (B) If repair and rework is going to be performed and what
those
Time & Temp will be.
2. That the finished multilayer must withstand 3 cycles of a 288C-10
sec.
solder-dip without delamination or hole cracking, measures and checked
in
(a) Ground-plane area AND (b) In the BGA area before the
board
is shipped.
Happy Holden
Asian Pacific Materials
"Stadem, Richard D." <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
05/26/2006 11:56 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
"Stadem, Richard D." <[log in to unmask]>
To
[log in to unmask]
cc
Subject
Re: [TN] Rohs Weeeeeee board material
That is the purpose of a thorough process/procedures audit done
periodically to ensure the material received is going to be good.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Tempea, Ioan
Sent: Friday, May 26, 2006 10:50 AM
To: [log in to unmask]
Subject: Re: [TN] Rohs Weeeeeee board material
Hi,
I guess we have a good idea now of the difficulties in specifying and
manufacturing lead-free capable PCBs. The next question that comes to my
mind is how are we going to assess if the PCBs that are well speced are
what we expect?
I mean, the spec can be OK, whether perfect IPC-4010 slash sheets are
developed, or STII is implanted. But the manufacturer might still use
expired prepregs, they can have lamination problems, and so on.
What tests shall a contract manufacturer or OEM with no in-house testing
capability impose, in order to have the confidence that they receive
what they specified?
Thanks,
Ioan
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