Hello,  Recently, we observed a wedge formation in through hole that occurred in lamination pretreatment with oxide replacement treatment. This defect became seriously under stronger desmear condition but was not found in black oxide treatment. Chemical supplier suggests that an additional alkaline post dip following the oxide replacement process could solve this problem.


  We don't have any mass production information for alkaline post dip.


  Does anyone have mass production experience at oxide replacement + alkaline post dip process?


  Does it have any concern or reliability issue for this process at high reliability products(such as server, network, workstation, HLC PCB, etc.)


  Sagiters


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