Werner,

The way I see it is this:

a physical object is limited in it's ability to absorb heat only by itself.
It's design of materials determines the rate in which it will absorb the
heat. While the vapor phase technology does allow the heat to transfer
faster, it is still only a method of heat transfer. In a convection
atmosphere, I can run the belt speed up, but I also have to increase the
preheat temps and tinker with the last two or three zones to get the peak
temp there and let it stay for <x> amount of time. as long as I stay in the
4 to 5 minute process time, I am alright. The same can be said for vapor
phase. I can raise the temp in the chamber, I just need to let it be there a
shorter amount of time. It's virtually impossible to overheat the board, but
parts can be shocked. I just make sure I utilize the preheat section for
just that.

Of course, the other variables, such as flux activation, must be observed as
well.

Jason Gregory
Manufacturing Engineer
Innova Electronics
(281)653-5593
(281)653-5594 fax
(281)594-0602 cell
[log in to unmask]



  _____

From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Tuesday, April 11, 2006 2:13 PM
To: [log in to unmask]; [log in to unmask]
Subject: Re: [TN] RD Technologies Vapor Phase Users


Hi, Jason & All,
Why would you need LS-260 [I am assuming that means the T=260]; the whole
point of vapor phase is that you can solder at temperatures of Liquidus+~5C
rather than Liquidus+~20-25C

Werner


---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------