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April 2006

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Subject:
回覆: RE: [TN] Void issue after soldering
From:
Lin Leo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Lin Leo <[log in to unmask]>
Date:
Tue, 11 Apr 2006 11:18:44 +0800
Content-Type:
text/plain
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text/plain (45 lines) 
I am interested the void just above intermetallic compound(IMC) at SMT & BGA.

Richard Kraszewski <[log in to unmask]> ：  Please provide more details. Through-hole, surface mount, BGA, ?, etc.

________________________________

From: TechNet on behalf of Lin Leo
Sent: Sat 4/8/2006 2:20 AM
To: [log in to unmask]
Subject: [TN] Void issue after soldering



Hi,

Did anyone have literature or web site that discusses void issue after soldering?



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