TECHNET Archives

April 2006

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re: IPC-TM-650 section 2.6.8
From:
Franklin D Asbell <[log in to unmask]>
Reply To:
[log in to unmask]
Date:
Mon, 10 Apr 2006 08:14:39 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (48 lines) 
What this test (thermal stress) is attempting to discover is the affect
typical processing/assembly would have on a printed board, specifically hole
wall quality and printed board integrity.

Another test that may be more suitable to what I believe you are asking is
rework simulation (IPC-TM-650 2.4.36).

Franklin

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor G. Hernandez
Sent: Monday, April 10, 2006 6:47 AM
To: [log in to unmask]
Subject: [TN] IPC-TM-650 section 2.6.8

Fellow TechNetters:

      Section 5.7  Evaluation:   What is typically expected of a cross
section when 1x, 2x or 3x test are conducted on a coupon.
If this is the case wouldn't similar artifacts be expected from a Forced
Rework Action to demonstrate Process capability.

Victor,

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2