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April 2006

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Subject:
Re: Void issue after soldering
From:
Sri Maganti <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Sun, 9 Apr 2006 17:23:01 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (95 lines) 
I belive there is an IPC spec which explains in detail about the void
criteria. I belive it is IPC 7095.

thanks

Sri







Richard Kraszewski <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
04/08/2006 01:05 PM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Richard Kraszewski <[log in to unmask]>


To
[log in to unmask]
cc

Subject
Re: [TN] Void issue after soldering






Please provide more details.  Through-hole, surface mount, BGA, ?, etc.

________________________________

From: TechNet on behalf of Lin Leo
Sent: Sat 4/8/2006 2:20 AM
To: [log in to unmask]
Subject: [TN] Void issue after soldering



Hi,

  Did anyone have literature or web site that discusses void issue after
soldering?



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for additional information, or contact Keach Sasamori at [log in to unmask] or
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