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April 2006

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Subject:
From:
Jeffrey Bush <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jeffrey Bush <[log in to unmask]>
Date:
Sat, 1 Apr 2006 09:57:17 -0500
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Pink Ring?

Jeffrey Bush
Director, Quality Assurance and Technical Support
VERMONT CIRCUITS INCORPORATED 
           76 Technology Drive - POB 1890 
              Brattleboro, Vermont 05302
                Voice - 802.257.4571 ext 21
                    Fax - 802.257.0011
                       <http://www.vtcircuits.com/> 
                           

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of ? ??
Sent: Saturday, April 01, 2006 8:06 AM
To: [log in to unmask]
Subject: [TN] Wedge from Oxide Replacement treatment

 Hello,  Recently, we observed a wedge formation in through hole that occurred in lamination pretreatment with oxide replacement treatment. This defect became seriously under stronger desmear condition but was not found in black oxide treatment. Chemical supplier suggests that an additional alkaline post dip following the oxide replacement process could solve this problem.


  We don't have any mass production information for alkaline post dip.


  Does anyone have mass production experience at oxide replacement + alkaline post dip process?


  Does it have any concern or reliability issue for this process at high reliability products(such as server, network, workstation, HLC PCB, etc.)


  Sagiters


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