>  -----Original Message-----
> From:         Automatic digest processor
> [mailto:[log in to unmask]]
> Sent: Sunday, March 19, 2006 12:00 AM
> To:   Recipients of TechNet digests
> Subject:      TechNet Digest - 17 Mar 2006 to 18 Mar 2006 (#2006-73)
>
>  << Message: TechNet Digest - 17 Mar 2006 to 18 Mar 2006 (#2006-73) >>  <<
> Message: Tech Briefs Question ?? >>  << Message: Re: PCB Fab Notes for
> LF-Soldering >>  << Message: <No subject given> >>  << Message: Re: Die
> Punching PWBs as opposed to drilling and NC routing >>  << Message: Re:
> PCB Inner-Layer Separation >>  << Message: Re: Die Punching PWBs as
> opposed to drilling and NC routing >>  << Message: Re: Die Punching PWBs
> as opposed to drilling and NC routing >>  << Message: Re: FW: [TN]
> Immersion Tin Specification >>  << Message: Re: Die Punching PWBs as
> opposed to drilling and NC routing >>

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------