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April 2006

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Subject:
From:
"Whittaker, Dewey (AZ75)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Whittaker, Dewey (AZ75)
Date:
Wed, 5 Apr 2006 12:58:49 -0700
Content-Type:
text/plain
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Per the requirements of the pending release of Rev D of IPC-SM-840, the
PCB shall be cleaned to achieve an acceptable level of cleanliness. The
determination of cleanliness shall be per IPC-TM-650, Method 2.3.25;
Method 2.3.25.1; Method 2.3.28; Method 2.3.38; or Method 2.3.39. 
Dewey 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kevin Glidden
Sent: Tuesday, April 04, 2006 8:05 AM
To: [log in to unmask]
Subject: [TN] PCB cleanliness prior to soldermask

Is there a spec for testing a bare PCB prior to solder mask application?
Is it customary to perform an ionic cleanliness test prior to
application of SM?



Kevin Glidden
Manufacturing Engineer
Luminescent Systems Inc.
4 Lucent Drive
Lebanon, NH 03766-1439
Tel # (603) 643-7766 ext. 3152
Fax # (603) 643-5947



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