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April 2006

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Subject:
From:
Russ Winslow <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Russ Winslow <[log in to unmask]>
Date:
Tue, 25 Apr 2006 21:28:31 -0700
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Unfortunately the Technet rules http://www.ipc.org/contentpage.asp?PageID=4.3.0 say that we must not discuss pricing on the forum. I believe it is O.K. to say that low pin-count DIPs and CLCC's are at the low-end and high pin count complex ICs are at the high-end.  Pricing is related to; lot size, how many components will fit on a pick-up head at a time, the duration of preheat, the fragility of the leads, what testing is performed (hermeticity, acoustic imaging, lead scanning...), whether you want to buy an overpriced insurance policy, etc.  Hand dipping is typically cheaper and is not as uncommon as one may think (but we won't do it).  Keep in mind that tin to tin-lead conversions are the cheapest and tin-lead to tin-silver-copper conversions are the most expensive.  Keeping the Pb below 0.1% causes frequent pot dumping or the use of double dipping.  Neither are very attractive.

In the old days the customers would send Gold plated components and wanted Lead(Pb)in return. <good business>  Now they send Lead and want Silver <bad business>.  I sure miss the old days.

Feel free to contact me offline for detailed price information.

There is a lot more to Hot Solder Dip (HSD) than most people think and there are significant variations in the methods utilized.  What may work well for one part-type or application could be awful for the reliability of another.  

To help resolve these issues the Government Electronics and Information Technology Association (GEIA) has formed a task group to create an industry standard for Hot Solder Dip (HSD). The document will be known as GEIA-STD-0006  "Requirements for Using Solder Dip to Replace the Finish on Electronic Components"

The concept is that HSD will allow the defense and high-reliability community to continue using tin-lead solders and avoid the risk of tin whiskers.  This document will help ensure that the HSD process will be performed correctly.

We wish to invite anyone interested in helping create this document to participate.  We especially need technical people who have experience with hot solder dip of components.

Please contact me for more information.  A rough draft of this document is currently available and we are soliciting comments.

Thanks & Regards,
Russ Winslow

Six Sigma
905 Montague Expwy
Milpitas, CA  95035 

www.sixsigmaservices.com
Phone (408) 956-0100 x 111




-----Original Message-----
From: - Bogert [mailto:[log in to unmask]]
Sent: Monday, April 24, 2006 3:09 PM
To: [log in to unmask]
Subject: [TN] Seeking cost information to do solder dip of part leads


April 24, 2006

Does anybody have cost information on what it costs, on a per part basis, to solder dip component leads with Sn63 solder as a tin-whisker mitigation method, and is this cost dependent on how many terminations/leads the part may have?

Solder dipping non-Pb leads/terminations is an acceptable tin whisker mitigation method as long as the complete lead/termination is covered with solder.

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