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April 2006

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Subject:
From:
Alexandra Curtis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Alexandra Curtis <[log in to unmask]>
Date:
Tue, 25 Apr 2006 15:12:33 -0500
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IPC announces the next International Conference on Flexible Circuits and Chip Scale Packaging to be held July 24-26 in Minneapolis, MN. Flexible circuitry and chip scale packaging (CSP) - a mix of seemingly unrelated topics, in fact are the missing pieces to the interconnection puzzle. Both of these topics are equally important in their effect on electronics manufacturing in this competitive marketplace.

The blending of these technologies is well underway, with new designs, materials and applications appearing on a regular basis. Don't miss this opportunity to find out everything you need to know about flexible circuits, and chip scale packaging.

While this international conference is highlighting the combination of flexible circuits and chip scale technologies, it is also recognized that the topics have critical and independent properties.  Current developments with these areas will also address within this conference.  

Potential topics for presentations at the Flex and Chips Conference are:

CSP Standards Progress
Wafer Level CSP 
CSP Design
CSP Die Attach
CSP Solder Joint Reliability
Flex Processing Innovations
Flex Assembly
Flex Market Trends 
Non-CSP Flex Applications 
Flex Test and Reliability
Flex HDI for CSP Applications
CSPs in Three Dimension
Flex and CSP Materials
Design for CSPs on Flex
Flex with CSP Yields
Flip Chip Development
Flex and Lead Free
Advanced Packaging

The conference is offering presentation time slots between 30-45 minutes. Proposals are also solicited from individuals interested in teaching full-day tutorials (six hours) or half-day workshops (three hours) to a class of up to 30 persons on topics in the field. Examples include; reliability, process issues, rework, plating and surface finishes, design for lead-free, design for recycling etc.

To submit an abstract or course proposal, please visit the Flex & Chips website at www.ipc.org/FlexNChips or e-mail your submission to [log in to unmask] Companies interested in information on the benefits associated with event sponsorship or exhibiting in our tabletop exhibit, please contact Tina Nerad at 847-597-2826 or e-mail at [log in to unmask]

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