Leo:
You are having this problem on both HASL and immersion Tin boards?
This would imply that the cause of the problem is before either is applied.
What are you using for an etch resist? Tin or Tin Lead, or photoresist?
Rudy Sedlak
RD Chemical Company
Lin Leo <[log in to unmask]> wrote: Hi,
I met ionic contamination problem at HASL and Immersion Tin surface finish board.(SEC values were measured from instrument Omega 600) I found significant difference at different patteren. The more through holes, the higher ionic contamination.
Did anyone experience in this phenomena? Any literature/report has discussed the factors resulted in the ionic contamination? How to clean the boards to decrease this defect?
Thanks
Leo
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