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April 2006

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Subject:
From:
John Burke <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, John Burke <[log in to unmask]>
Date:
Mon, 24 Apr 2006 09:00:04 -0700
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Very interesting.

Does that mean that patent cover the solder mask open window and trace
width?. If you simply change nothing on your design, but open up a slot
in the solder mask on the trace side of the pad you will get a "keyhole"
effect in the final soldered joint automatically.


John

John Burke
Senior Manager - Operations , Optichron
[log in to unmask]
W: 510 249 5233
M: 408 515 4992
http://www.optichron.com
Profile: https://www.linkedin.com/e/fps/2665502/

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joe Fjelstad
Sent: Saturday, April 22, 2006 1:39 PM
To: [log in to unmask]
Subject: Re: [TN] BGA and CGA pad questions.

Hi Werner,

Patent law is always tricky as you well know.

In this case having regular shaped (square, round, hexagon octagon) land
as
opposed to an asymmetric or irregular shape (e.g., pad with a spur) is
something different. If the square pad does the job, then there is no
need  to use
the pad with the spur concept but I don't believe that it would
invalidate the
patent. It all depends on what is claimed.

Very best,
Joe

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