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April 2006

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Mon, 24 Apr 2006 10:43:54 EDT
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Hi Steven,
The only study that did this extensively is reported on in IPC-TR-579 —"Round 
Robin Reliability Evaluation of Small Diameter Plated Through Holes in 
Printed Wiring Boards." For the same delta-T, there is pretty good correspondence. 
Also, for bare PCBs, it does not matter whether you change T's fast [T-shock] 
or more slowly, since for a symmetrically built PCB T-gradients do not affect 
the loading stresses [in contrast to assemblies].
Also, IPC-TR-486 —"Report on Round Robin Study to Correlate Interconnect 
Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting 
the Presence of Inner-Layer Separations" provides good correlative information.

Werner

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