Yup.
Laser drill at 4 mil diameter and fill with good conductive epoxy.
When I hooked the board up I eased the fabrication a bit by doing the blinds
only from layer 1 to layer 2 and layer 15 to layer 16. (Layers 2 and 15
were flooded GND planes).
Boards were fabbed at Hallmark Circuits in San Diego. I talked to them
before I routed a signal and the boards worked fine.
Bob Wilson
CID
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ted Kong
Sent: Friday, April 21, 2006 10:57 AM
To: [log in to unmask]
Subject: [TN] Solder joint reliability of BGAs and 0402 chip on blind vias
Hi all,
Has anyone used blind vias on BGAs or 0402 chip
packages? Will they form reliable solder joints?
Thanks all in advance.
Ted
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