All,
   I was talking with our Manufacturing engineer the other day and the
people that make the SMD re-work station tools, about the pads used for
both BGA's and CGA's. The vendor was saying that diamond pads, (square
on a 45') were better for X-Ray inspection because you can see the pad
verses the pin/ball better during the inspection of the solder joints.
The X-Ray manufacturer' says the same thing, but has anyone done it this
way yet? It sounds good to me, but does anyone have any practical
experience with the diamond pads? How do you figure size between round
to square, etc.? Is it just area calculations or flat side the same as
diameter, etc.? Paste Mask sizing, Solder Mask defined, (not my thought)
or just the standard oversize, etc.? These would be for high-reliability
applications and from what I understand, the CGA is better in that
respect. Any info would be great to hear. Thanks in advance.


Scott Decker
AKA: Padmasterson
Broad Reach Engineering CAE
Ph. 480-377-0400 Ext. 34
FAX. 480-968-4597
Tempe, AZ.


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