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April 2006

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Subject:
From:
Rex Waygood <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Rex Waygood <[log in to unmask]>
Date:
Tue, 4 Apr 2006 14:57:13 +0100
Content-Type:
text/plain
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text/plain (86 lines)
This raises the interesting point that this is a bath contamination
limit not the spec for solder.
Ensure that your suppliers are providing 'lead free' solders with a good
head room from the 0.1% legal limit. Initial specs for some PbF solders
were just stated as less than 0.1%; i.e. 0.09999% is less than 0.1% but
doesn't give you any headroom or ability to dilute contamination. Our
input solder is about 0.03% Pb.

Rex

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joe Fjelstad
Sent: 03 April 2006 15:51
To: [log in to unmask]
Subject: Re: [TN] Maximum Contamination Levels in Solder

In a message dated 4/2/2006 6:40:34 PM Pacific Daylight Time,
[log in to unmask] writes:

Tin             94.5 -  97.5%
Arsenic         0.030% max
Antimony   0.500% max
Gold           0.200% max
Iron            0.020%  max
Nickel          0.010% max
Bismuth   0.250% max
Aluminum         0.005% max
Copper          0.300%  max
Silver          3.750 - 4.250 %
Zinc   0.005% max
Cadmium 0.005%  max
Indium          0.100% max
Sulphur   0.005% max
Phosphorous     0.010%  max
Lead             balance



Why not "0.1% max" for lead instead of "balance"? It is the one element
that the EU parliament seems to be more concerned with and had set
definitive limits for.

Joe

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