The assembly side PWB manufacture has worked hard to quanify yield in terms
of "defects per million opportunities - DPMO". While this is not actually a
measure of scrap, this does even out differences between simple and complex
assemblies
Recently, the same group has started to try to quanify board fab in some
similar terms to DPMO. Board fabrication is not so easy to quantify as it is
harder to define an individual "opportunity".
At Apex/Expo time, this group was collecting the defect codes from several
board fabrication shops to try to get a feel for some metrics the committee
could track. Anyone interested should contact IPC Committee 5-22G under Greg
Hurst of BAE Systems or IPC Technical Staff LIason Jack Crawford, as a start.
Denny Fritz
MacDermid, Inc
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