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April 2006

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Subject:
From:
Dennis Fritz <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 19 Apr 2006 22:18:29 EDT
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The assembly side PWB manufacture has worked hard to quanify  yield in terms
of "defects per million opportunities - DPMO".   While  this is not actually a
measure of scrap, this does even out differences between  simple and complex
assemblies

Recently, the same group has started to try to quanify board  fab in some
similar terms to DPMO.   Board fabrication is not so  easy to quantify as it is
harder to define an individual "opportunity".

At Apex/Expo time, this group was collecting the defect codes  from several
board fabrication shops to try to get a feel for some metrics the  committee
could track.  Anyone interested should contact IPC Committee  5-22G under Greg
Hurst of BAE Systems or IPC Technical Staff LIason Jack  Crawford, as a start.

Denny Fritz
MacDermid, Inc

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