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April 2006

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Subject:
From:
Dennis Fritz <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 19 Apr 2006 13:30:20 EDT
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In a message dated 4/19/2006 12:02:59 PM Eastern Daylight Time,
[log in to unmask] writes:

Does IPC  have such a
specified standard or paragraph informing self life of lead  free coated
bare PCB



Shelf life is an issue that IPC does not specify.  The  reason is that the
storage conditions vary around the world, and from season to  season.  The
solderable life in Singapore could be a lot less than in  Minneapolis.

What is specified are "stress conditions" and "stress methods"  that you can
use to determine if your part will still solder, after  storage.  Or, you can
use the stress methodologies to determine that the  incoming part you receive
today will have the same storage capability as the  part you received last
week.  Hopefully, IPC methods will tell you if you  are getting good parts
consistently, and not getting poor storage parts  occasionally.

Denny Fritz
IPC Task group chairman 5-23d, Alternate Board Finish  Solderability Testing.
MacDermid, Inc.

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