Local (IR, hot air etc.) soldering is my least preferable way of SMT
manufacturing! It puts on risk the PWB - thermal stress and deformation, the
same goes for the component, especially large ones. As far the process time
is concerned - IMHO in other than prototyping i.e. mass production, the
reflow soldering should shorten the process time.

Best regards,
Yordan Venev
Manufacturing Manager
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Phil Nutting
Sent: Tuesday, April 18, 2006 5:56 PM
To: [log in to unmask]
Subject: [TN] IR Reflow of small area?


Good morning,

We have a new board design that wants a simpler soldering method.  The
design will use TO-247 or TO-264 leaded devices with the leads lap
soldered to the circuit board.  What is the best way to easily solder
these to the board.  A traditional hand soldering iron is one way.  Is
there a way, other than wave or large oven reflow that will reduce my
manufacturing time?  IR reflow, hot jet... ?  Oh ya, the leads will be
soldered on the component side of the board and most other components
probably will be wave soldered thru-hole.

Thanks in advance.

Phil

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