I assume you are talking hi-volume, and you want a quick way of
soldering these few SMT parts without paying an operator to do it and
getting rid of the variability of the manual soldering operation.
Two good ways come to mind, and the processes are already developed,
check out the desktop soldering robots from Japan/Unix at
www.christopherweb.com, they can do it with laser or solder tips
automatically, with wire feed. This will eliminated having to apply
solder paste. There are other good machines out there that are
relatively quick and simple; www.pro-mation-inc.com and mta automation's
is especially good at www.mta.ch.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Phil Nutting
Sent: Tuesday, April 18, 2006 9:56 AM
To: [log in to unmask]
Subject: [TN] IR Reflow of small area?

Good morning,
 
We have a new board design that wants a simpler soldering method.  The
design will use TO-247 or TO-264 leaded devices with the leads lap
soldered to the circuit board.  What is the best way to easily solder
these to the board.  A traditional hand soldering iron is one way.  Is
there a way, other than wave or large oven reflow that will reduce my
manufacturing time?  IR reflow, hot jet... ?  Oh ya, the leads will be
soldered on the component side of the board and most other components
probably will be wave soldered thru-hole.
 
Thanks in advance.
 
Phil

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