They have a document called ANGEN034B.pdf that talks about mounting
considerations but I truly wondered about the survivability of the part
after reading all the cautions...
http://tinyurl.com/la2rw <http://tinyurl.com/la2rw>
I wish there was a product out there I could look at that used this device
so I had some feeling for the long term robustness of the assembly...
Thanks for your take on the solder compliancy issue... I tend to agree.
Perhaps different package is a better choice... I may recommend that on
Monday.
Best regards,
Bill Brooks - KG6VVP
PCB Design Engineer, C.I.D.+, C.I.I.
Tel: (760)597-1500 Ext 3772 Fax: (760)597-1510
Datron World Communications, Inc.
_______________________________________
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-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Friday, April 14, 2006 1:22 PM
To: [log in to unmask]; [log in to unmask]
Subject: Re: [TN] Mounting the Mitsubishi RD07MVS1 Surface Mount SLP package
I wrote earlier:
Hi Nill,
Could not locate a data sheet on Mitsubishi MOSFET RD07MVS1 at the given
website: http://www.mitsubishichips.com/Global/index.html.
Found a reliability section "III. FAILURE MECHANISMS OF SEMICONDUCTOR
DEVICES". However, this section does not give you much confidence. For one,
they use
Norris-Landzberg [many Japanese companies use it for some unfathonable
reason]
even so it has been clearly shown [by IBM no less shortly after the initial
Norris-Landzberg paper publication] that it does not work for solder,
because
it cannot account for dwell time effects. For another, they report results
from
testing to low T-extremes from -40 to -100C [!?], and show failures as early
as 30 cycles [!?].
None of this gives me a warm, fuzzy feeling.
Werner
After seeing the data sheet at <http://tinyurl.com/fpgqa>, showing a ceramic
device dissipating 50 W, being ~6X5 mm in size , and having no provision for
solder attachment with any kind of compliancy, i not on have no 'warm, fuzzy
feeling', but a lump of ice in my stomach.
If you use this devicxe in an operating environment with some thermal cyclic
loading, you are assured premature SJ-failures.
Werner
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