I wrote earlier:
 Hi Nill,
Could not locate a data sheet on Mitsubishi MOSFET RD07MVS1 at the given
website: http://www.mitsubishichips.com/Global/index.html.
Found a reliability section "III. FAILURE MECHANISMS OF SEMICONDUCTOR
DEVICES". However, this section does not give you much confidence. For one,
they use
Norris-Landzberg [many Japanese companies use it for some unfathonable
reason]
even so it has been clearly shown [by IBM no less shortly after the initial
Norris-Landzberg paper publication] that it does not work for solder, because
it cannot account for dwell time effects. For another, they report results
from
testing to low T-extremes from -40 to -100C [!?], and show failures as early
as 30 cycles [!?].
None of this gives me a warm, fuzzy feeling.
Werner

After seeing the data sheet at <http://tinyurl.com/fpgqa>, showing a ceramic
device dissipating 50 W, being ~6X5 mm in size , and having no provision for
solder attachment with any kind of compliancy, i not on have no 'warm, fuzzy
feeling', but a lump of ice in my stomach.
If you use this devicxe in an operating environment with some thermal cyclic
loading, you are assured premature SJ-failures.

Werner

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------