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April 2006

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Subject:
From:
John Burke <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, John Burke <[log in to unmask]>
Date:
Fri, 14 Apr 2006 13:13:19 -0700
Content-Type:
text/plain
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text/plain (74 lines)
Hi guys,

The data sheet is here:

http://tinyurl.com/fpgqa

I notice that it has one long connection running along the underside,
presumably for heat transfer.

John

John Burke
Senior Manager - Operations , Optichron
[log in to unmask]
W: 510 249 5233
M: 408 515 4992
http://www.optichron.com
Profile: https://www.linkedin.com/e/fps/2665502/

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: Friday, April 14, 2006 1:01 PM
To: [log in to unmask]
Subject: Re: [TN] Mounting the Mitsubishi RD07MVS1 Surface Mount SLP
package

Hi bill,
Could not locate a data sheet on Mitsubishi MOSFET RD07MVS1 at the given
website: http://www.mitsubishichips.com/Global/index.html.
Found a reliability section "III. FAILURE MECHANISMS OF SEMICONDUCTOR
DEVICES". However, this section does not give you much confidence. For
one, they use
Norris-Landzberg [many Japanese companies use it for some unfathonable
reason]
even so it has been clearly shown [by IBM no less shortly after the
initial
Norris-Landzberg paper publication] that it does not work for solder,
because
it cannot account for dwell time effects. For another, they report
results from
testing to low T-extremes from -40 to -100C [!?], and show failures as
early
as 30 cycles [!?].
None of this gives me a warm, fuzzy feeling.

Werner

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