John,
I would be interested in more of your info about these types of systems.
Thanks,
Jason Gregory
Manufacturing Engineer
Innova Electronics
(281)653-5593
(281)653-5594 fax
(281)594-0602 cell
[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: Wednesday, April 12, 2006 12:01 PM
To: [log in to unmask]
Subject: Re: [TN] RD Technologies Vapor Phase Users
Just a note, some of those systems put vacuum into the chamber during the
reflow cycle to remove air voids etc.
For those that have not seen one, the process is quite the piece of
engineering. The board is on a carrier, the carrier is placed by the carrier
handler onto a flat base plate in the reflow zone. Once the board is up to
temperature a chamber comes down over the board and carrier and seals to the
base plate ( the chamber that comes down is in effect a 5 sided box with a
seal around the open face and an outlet tube on the opposite side with a
vacuum tube attached). Then the vacuum is applied, the vacuum is then
released, the chamber withdraws, and the handler finishes the rest of the
cycle delivering the resulting boards with very nice void free solder
joints.
John Burke
Senior Manager - Operations , Optichron
[log in to unmask]
W: 510 249 5233
M: 408 515 4992
http://www.optichron.com
Profile: https://www.linkedin.com/e/fps/2665502/
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Mike Fenner
Sent: Wednesday, April 12, 2006 9:32 AM
To: [log in to unmask]
Subject: Re: [TN] RD Technologies Vapor Phase Users
I offer the following additional comment on VPR as a technique not to any
specific machine.
The latest generation VPR machines are much better than the 1980's types.
However you do need to be a little sceptical of some of the claims for some
machine types.
Yes the delta t at peak reflow is less, it's inherent in the process and
makes VPR a good choice for prototypes, low run builds or assemblies with
acute or odd thermal loadings.
But
What about the ramp up? some machines do not address this very well,
particularly on the second board.
VPR is claimed to be anaerobic but that is only true after a time in a
fully saturated vapour system (when all air has been replaced by the
vapour), if the machine Depends on a variable vapour concentration for
heating profile it can't be saturated.
At the same time the condensation is possibly going to be variable on the
ramp up according to component or local mass so the big claim of VPR for low
delta T can be some what overstated when considering the process as a
whole...
Actually there is always going to be some air in the reflow zone, the best I
ever measured (on the 180s machines admitted) was about 100-150 ppm oxygen
equivalent, be interesting to know what users are actually getting.
The capacity of VPR for very rapid uniform heat transfer with little
mechanical stress can not be over estimated, (up to 50C/second is
possible)
but if this is taken advantage of on soldering then the flux volatiles will
demonstrate that property dramatically. Conversely this is facility is good
for curing polymers /adhesives.
Regards
Mike Fenner
Indium Corporation
T: + 44 1908 580 400
M: + 44 7810 526 317
F: + 44 1908 580 411
E: [log in to unmask]
W: www.indium.com
Pb-free: www.Pb-Free.com
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jason Gregory
Sent: 11 April 2006 18:38
To: [log in to unmask]
Subject: Re: [TN] RD Technologies Vapor Phase Users
Hi Ramon,
Pros:
-Ability to process problematic high temp boards (thicker than .063", high
layer counts, etc.) and not have to jack with as many variables as in
convection or IR -Excellent thermal equilibrium across the assembly and not
having to worry about shadowing or thermal thieving -Probing your board to
determine preheat and then knowing your peak area's temp already and looking
through a little window to observe reflow and giving an extra 15 or 20
seconds over for wetting
Cons:
-Fluid is expensive and if you have excess dragout, you will notice
financially. Fluid is about $1000/gallon -Higher than usual expectations for
tombstoning if your board design is a little lopsided (heavy ground planes
connected to one side of passives) or if your process is a little off.
-Machine is a booger to clean
Jason Gregory
Manufacturing Engineer
Innova Electronics
(281)653-5593
(281)653-5594 fax
(281)594-0602 cell
[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dehoyos, Ramon
Sent: Tuesday, April 11, 2006 11:36 AM
To: [log in to unmask]
Subject: Re: [TN] RD Technologies Vapor Phase Users
Hi Jason:
I believe that Vapor phase has a lot of good merits.
Could you share your experience with the machine? Pros and Cons.
Regards,
Ramon
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jason Gregory
Sent: Tuesday, April 11, 2006 12:13 PM
To: [log in to unmask]
Subject: Re: [TN] RD Technologies Vapor Phase Users
Hello Steve,
We have a RD here and we use Galden HS-260
Jason Gregory
Manufacturing Engineer
Innova Electronics
(281)653-5593
(281)653-5594 fax
(281)594-0602 cell
[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
Sent: Tuesday, April 11, 2006 10:33 AM
To: [log in to unmask]
Subject: [TN] RD Technologies Vapor Phase Users
Mornin' All!
I've just got the opportunity to work with a new vapor phase reflow system
here at my new position. It's a RD Technologies RD3 with a vapor recovery
system. We're in the process of hooking it up, we haven't yet started it up.
I worked with a vapor phase many years ago (1988), and this system is much
nicer than what I remember about the system I worked with in the past.
I was wondering if there are any RD Technologies users out there that have
any "words of wisdom" that they might share with me about the system I'm
that going to be working with. BTW, we're going to using Galden heat
transfer fluids.
Kind regards,
-Steve Gregory-
Senior Production Engineer
OAI Electronics
6960 East 12th Street
Tulsa, Oklahoma 74112
(918) 836-0507
(918) 706-2779 CELL
(918) 836-0184 FAX
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