Years ago, there are attempt to use ribbon bond to replace the leads -
direct chip attach (actually done on some of the high-rel parts). The
performance is equal if not better. However, it is consider at the time
slower than the QFP, cost more...With all the ultra fine pitch nowadays, I
believe the direct bonding possibly provide much benefit compare to solder
in both performance as well as cost/time... (faster bonder, more efficient
ultrasonic transducer, etc.etc.).
jk (my 2 cents)
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Leo Higgins
Sent: Monday, April 03, 2006 12:02 PM
To: [log in to unmask]
Subject: Re: [TN] Ultrasonic Weld to PCB with Ni Pads
The thermosonic gold ball bond is made to the IC pad, and the second bond
(wedge bond) is made to Ni/Au plated copper pads on typical BGA substrates.
Aluminum could be, but is not generally used in such a package construction.
Best regards,
Leo
Leo M. Higgins III, Ph.D.
Vice President, Technical Support Operations
ASAT, Inc.
3755 Capital of Texas Highway, Suite 100
Austin, Texas 78704
office phone 512-383-4593
mobile 512-423-2002
[log in to unmask]
www.asat.com
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Eric CHRISTISON
Sent: Monday, April 03, 2006 3:25 AM
To: [log in to unmask]
Subject: Re: [TN] Ultrasonic Weld to PCB with Ni Pads
Ulrasonic welding is routinely done at a chip packaging level onto FR4
substrates.
However we're talking 1 'thou diameter gold or aluminium wires. I believe
the weld is made onto Ni/Ag plated pads.
Regards,
Eric Christison
Mechanical Engineer
Home, Personal, Communication Sector - Imaging Division
STMicroelectronics
33 Pinkhill
Edinburgh
EH12 7BF
Tel: +44 (0)131 336 6165
Fax: +44 (0)131 336 6001
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
> Sent: Friday, March 31, 2006 6:38 PM
> To: [log in to unmask]
> Subject: Re: [TN] Ultrasonic Weld to PCB with Ni Pads
>
>
> Not tried that one myself, couple of things though, the
> ultrasonic energy is going to have to have a sideways vector
> to "scub away" oxides. I am not sure if the systems normally
> used will do this or not.
>
> Second point is I recall that those ultrasonic welding
> systems rely on a Z axis force, and I am not sure what this
> will do to the shape/integrity of your FR4 PCB.
>
> TRY IT..............................
>
> John
>
> John Burke
> Senior Manager - Operations , Optichron [log in to unmask]
> W: 510 249 5233
> M: 408 515 4992
> http://www.optichron.com
> Profile: https://www.linkedin.com/e/fps/2665502/
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Rodney Miller
> Sent: Friday, March 31, 2006 6:32 AM
> To: [log in to unmask]
> Subject: Re: [TN] Ultrasonic Weld to PCB with Ni Pads
>
> Anyone, anyone, Bueller, Bueller....
>
> I think this will work, but I'm interested if anyone has
> applied this to PCB before?
>
> -----Original Message-----
> From: Rodney Miller [mailto:[log in to unmask]]
> Sent: Wednesday, March 29, 2006 10:06 AM
> To: 'TechNet '
> Subject: Ultrasonic Weld to PCB with Ni Pads
>
>
> I have a component with Nickel lead, a battery, and
> soldering/tinning it has been troublesome.
>
> I want to Ultrasonically Weld the leads to the PCB. Can I do
> this with PCB FR4 Material. I was thinking if I cannot do it
> through the PCB laminate, I might add a Via in pad and fill
> the via with Nickel plate.
>
> The laminate is .030 and the finish option on the pads would
> be Selective Immersion Ni, plated up to ???? 10um Maybe?
>
> Any input appreciated....
>
> Rodney L. Miller
> Tri-onics Inc
> Highland / Shanghai
>
> Integrity and Solutions for Electronic Outsourcing
>
>
>
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