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April 2006

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Subject:
From:
Jason Gregory <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jason Gregory <[log in to unmask]>
Date:
Wed, 12 Apr 2006 07:43:14 -0500
Content-Type:
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text/plain (262 lines)
Good point, Richard.


Jason Gregory
Manufacturing Engineer
Innova Electronics
(281)653-5593
(281)653-5594 fax
(281)594-0602 cell
[log in to unmask]

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Wednesday, April 12, 2006 7:23 AM
To: [log in to unmask]
Subject: Re: [TN] RD Technologies Vapor Phase Users

So, in an attempt to heat more massive or more massively mixed assemblies
where the solder is required to be lead-free, we are doing a thousand times
more harm to ourselves in adapting a condensation process to prevent a very,
very small (really, non-existant) threat of lead leaching into the water.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Brian Ellis
Sent: Wednesday, April 12, 2006 1:25 AM
To: [log in to unmask]
Subject: Re: [TN] RD Technologies Vapor Phase Users

You forgot some important pros and cons:
Pro:
- The reflow/soldering is done in a totally anaerobic atmosphere.
- Sublimated flux components remain substantially mixed with the vapour with
less re-depositing on the assembly.
- The chemical inertness of the fluid will avoid reaction with any materials
on the assembly and bonding will be minimal, except to fluoropolymers.
Con:
- The board + components have to be designed/selected so that the thermal
distribution is a uniform as possible; heavy components may take much longer
to reach the asymptotic temperature, meaning the lighter ones are submitted
to the temp for sufficient time to have a different IMC profile.
- It is impossible to avoid expensive vapour losses because of entrapment
under large components and in the windings of non-impregnated wound
components: not even residence in a vacuum oven will remove them all.
- The fluid vapour is amongst the worst known compounds for promoting
climate change effects (greenhouse gas) with global warming potentials
>10,000 times worse than CO2 and atmospheric lifetimes (residence time)
in the tens of thousands of years. The compounds are controlled substances
in the Kyoto Protocol. Furthermore, the production of the fluid is extremely
energy-intensive, requiring large CO2 emissions from fossil-fuel power
plants.

Brian

Jason Gregory wrote:
> Hi Ramon,
>
> Pros:
> -Ability to process problematic high temp boards (thicker than .063",
> high layer counts, etc.) and not have to jack with as many variables
> as in convection or IR -Excellent thermal equilibrium across the
> assembly and not having to worry about shadowing or thermal thieving
> -Probing your board to determine preheat and then knowing your peak
> area's temp already and looking through a little window to observe
> reflow and giving an extra 15 or 20 seconds over for wetting
>
> Cons:
> -Fluid is expensive and if you have excess dragout, you will notice
> financially. Fluid is about $1000/gallon -Higher than usual
> expectations for tombstoning if your board design is a little lopsided

> (heavy ground planes connected to one side of passives) or if your
> process is a little off.
> -Machine is a booger to clean
>
>
> Jason Gregory
> Manufacturing Engineer
> Innova Electronics
> (281)653-5593
> (281)653-5594 fax
> (281)594-0602 cell
> [log in to unmask]
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Dehoyos, Ramon
> Sent: Tuesday, April 11, 2006 11:36 AM
> To: [log in to unmask]
> Subject: Re: [TN] RD Technologies Vapor Phase Users
>
>         Hi Jason:
>                    I believe that Vapor phase has a lot of good
merits.
> Could you share your experience with the machine? Pros and Cons.
>         Regards,
>         Ramon
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Jason Gregory
> Sent: Tuesday, April 11, 2006 12:13 PM
> To: [log in to unmask]
> Subject: Re: [TN] RD Technologies Vapor Phase Users
>
> Hello Steve,
>
> We have a RD here and we use Galden HS-260
>
>
> Jason Gregory
> Manufacturing Engineer
> Innova Electronics
> (281)653-5593
> (281)653-5594 fax
> (281)594-0602 cell
> [log in to unmask]
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
> Sent: Tuesday, April 11, 2006 10:33 AM
> To: [log in to unmask]
> Subject: [TN] RD Technologies Vapor Phase Users
>
> Mornin' All!
>
> I've just got the opportunity to work with a new vapor phase reflow
> system here at my new position. It's a RD Technologies RD3 with a
> vapor recovery system. We're in the process of hooking it up, we
haven't yet started it up.
>
> I worked with a vapor phase many years ago (1988), and this system is
> much nicer than what I remember about the system I worked with in the
past.
>
> I was wondering if there are any RD Technologies users out there that
> have any "words of wisdom" that they might share with me about the
> system I'm that going to be working with. BTW, we're going to using
> Galden heat transfer fluids.
>
> Kind regards,
>
> -Steve Gregory-
> Senior Production Engineer
> OAI Electronics
> 6960 East 12th Street
> Tulsa, Oklahoma 74112
>
> (918) 836-0507
> (918) 706-2779 CELL
> (918) 836-0184 FAX
>
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