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| From: | |
| Reply To: | (Leadfree Electronics Assembly Forum) |
| Date: | Tue, 11 Apr 2006 18:20:14 -0700 |
| Content-Type: | text/plain |
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I may have some info to contribute here sometime in the not too distant
future. We are doing a lot of drop testing with QFNs and fpBGAs using the
Jedec procedure and specific procedures and drop-test equipment prescribed
by European companies.
Best regards,
Leo
Leo M. Higgins III, Ph.D.
Vice President, Technical Support Operations
ASAT, Inc.
3755 Capital of Texas Highway, Suite 100
Austin, Texas 78704
office phone 512-383-4593
mobile 512-423-2002
[log in to unmask]
www.asat.com
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-----Original Message-----
From: Leadfree [mailto:[log in to unmask]]On Behalf Of Joe Fjelstad
Sent: Tuesday, April 11, 2006 7:19 PM
To: [log in to unmask]
Subject: Re: Tin Plague
Hi Dave,
Thanks for the note back. I trust all is well with you.
The reason is that was some evidence presented by National Semiconductor to
our local CPMT group a few months back, that indicated that post thermal
cycling, (read that possible operational use) lead-free solder joints
perform
worse than traditional solders.
I am looking for additional data points to confirm or contest these early
findings.
Very best,
Joe
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