Hi John,
Attached are a couple more references/articles for your library.
Engelmaier, W., “Lead-Free (LF) Wave-Soldering: Can (Should) It Be Eliminated,
” Global SMT & Packaging, Vol. 5, No. 9, October 2005, pp. 46-50.
Engelmaier, W., “Printed Circuit Board Reliability: Needed PCB Design Changes 
for Lead-Free Soldering,” Global SMT & Packaging, Vol. 5, No. 8, September 
2005, pp. 41-44.
Engelmaier, W., “Reliability of Lead-Free (LF) Solder Joints Revisited,” 
Global SMT & Packaging, Vol. 3, No. 7, October 2003, pp. 26-27.
Engelmaier, W., “Reliability of Lead-Free (LF) Solder Joints,” Global SMT & 
Packaging, Vol. 3, No. 3, April 2003, pp. 36-38.
Engelmaier, W., “Reliability Assurance Testing for Pb-Free Solder Products,” 
Proc. Military and Space Electronics Conf., Los Angeles, CA, February 2003, 
pp. SEM#2 103-131.

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