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April 2006

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Subject:
From:
"Dave Delman (MA/NY DDave" <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Mon, 24 Apr 2006 00:18:51 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (49 lines)
Hi Mark, IPC LF Listservers,

Let me take another crack at this one since I didn't like my first answer.

http://listserv.ipc.org/scripts/wa.exe?
A2=ind0604&L=leadfree&D=0&T=0&X=51A2A101E52D6FE17F&[log in to unmask]&P=2064
4

<Materials declaration form IPC-1752 has a statement noting:
"If the item is an assembly with lower level parts, the declaration
encompasses all lower level material which the manufacturer has
engineering responsibility.">

OK, I buy this even though I didn't manage or participate in the writing.

<A contract manufacturer supplying a board assembly, by signing this, is
acknowledging only the solder process? Nothing is implied about the
components or board blank?>

It depends upon your customer and what your part of the bargain is.

If your customer performs engineering control of everything you receive and
you are only asked to do board assembly THEN what you wrote makes a lot of
common sense. You can only report on what you control... Your boss,
customer, reports on things beyond you. Common Sense right!!

<We can do our due diligence in insuring a compliant Bill of material,
and AVL, but to what extent are those out there off loading that
responsibility to suppliers, and asking them to provide an
all-encompassing declaration?>

Reading this again I understand my original confusion. You are NOT doing
due diligence for RoHS which I originally thought, you are doing due
diligence to meet or exceed your customer's requirements. SO NO!! you
should not expect yourself to report on lower level parts without your
customer asking, and paying you.


Yours in Engineering, Dave
YiEngr, MA/NY DDave

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