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April 2006

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Subject:
From:
"Endorf. Mark D." <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Thu, 20 Apr 2006 16:12:35 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (32 lines)
Materials declaration form IPC-1752 has a statement noting:
"If the item is an assembly with lower level parts, the declaration
encompasses all lower level material which the manufacturer has
engineering responsibility."

A contract manufacturer supplying a board assembly, by signing this, is
acknowledging only the solder process? Nothing is implied about the
components or board blank?

We can do our due diligence in insuring a compliant Bill of material,
and AVL, but to what extent are those out there off loading that
responsibility to suppliers, and asking them to provide an
all-encompassing declaration?

M. Endorf
Pearson

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