Subject: | |
From: | |
Reply To: | (Leadfree Electronics Assembly Forum) |
Date: | Thu, 20 Apr 2006 16:12:35 -0500 |
Content-Type: | text/plain |
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Materials declaration form IPC-1752 has a statement noting:
"If the item is an assembly with lower level parts, the declaration
encompasses all lower level material which the manufacturer has
engineering responsibility."
A contract manufacturer supplying a board assembly, by signing this, is
acknowledging only the solder process? Nothing is implied about the
components or board blank?
We can do our due diligence in insuring a compliant Bill of material,
and AVL, but to what extent are those out there off loading that
responsibility to suppliers, and asking them to provide an
all-encompassing declaration?
M. Endorf
Pearson
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