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What this test (thermal stress) is attempting to discover is the affect
typical processing/assembly would have on a printed board, specifically hole
wall quality and printed board integrity.
Another test that may be more suitable to what I believe you are asking is
rework simulation (IPC-TM-650 2.4.36).
Franklin
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor G. Hernandez
Sent: Monday, April 10, 2006 6:47 AM
To: [log in to unmask]
Subject: [TN] IPC-TM-650 section 2.6.8
Fellow TechNetters:
Section 5.7 Evaluation: What is typically expected of a cross
section when 1x, 2x or 3x test are conducted on a coupon.
If this is the case wouldn't similar artifacts be expected from a Forced
Rework Action to demonstrate Process capability.
Victor,
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