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March 2006

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From:
"Kane, Amol (349)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Kane, Amol (349)
Date:
Wed, 1 Mar 2006 07:16:38 -0500
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One other method to qualify the process might be to X-section 'n' boards to determine % hole fill and draw a statistical conclusion (hypothesis testing) that would validate the process and inspection may not be needed

Amol Kane
M.S (Industrial Eng.)
Process Engineer
Harvard Custom Manufacturing 
941 Route 38  Owego, NY 13827
Phone: (607) 687-7669 x349
[log in to unmask]

 -----Original Message-----
From:   TechNet [mailto:[log in to unmask]]  On Behalf Of John Berg
Sent:   Tuesday, February 28, 2006 1:44 PM
To:     [log in to unmask]
Subject:        Re: [TN] Solder Joint Inspection

If x-ray is not an option, you need to set up a soldering process that would not require inspection. On a thermally relieved pad that does not get sufficient fill, you need to preheat the pad area prior to hand soldering to compensate for the heat sinking. If you can get a dummy populated board, preheat it to a known reference level, and then remove the connector body to examine the % fill. Find the minimum reference preheat that will obtain your desired % fill. If you can't get a dummy populated board, you can use a few production boards to find the reference preheat by utilizing an ouitside x-ray service to determine the % fill.

>>> [log in to unmask] 2/28/2006 7:55 AM >>>
We are having a heck of a time inspecting some solder joints and could
use your help.

Per Class 3 a solder joint is supposed to have at least a 75% fill. We
have a circuit board that has large ground planes and hand soldered
connectors that are impossible to inspect for top side solder.

We do not have access to an x-ray and are wondering if there are any
clever ways to inspect these solder joints.

Thanks,

KennyB

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