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March 2006

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Subject:
From:
Jason Gregory <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jason Gregory <[log in to unmask]>
Date:
Mon, 6 Mar 2006 13:03:24 -0600
Content-Type:
text/plain
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text/plain (60 lines)
Kevin,

In IPC-A-610 Rev. D, it states clearly, for Class 3, "Minimum heel fillet
height is equal to solder thickness plus lead thickness."

If you have parts where the pad layout spread is larger than your component,
then the larger the difference will get you further away from the acceptable
spec.


Jason Gregory
Manufacturing Engineer
Innova Electronics
(281)653-5593
(281)653-5594 fax
(281)594-0602 cell
[log in to unmask]

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kevin Glidden
Sent: Monday, March 06, 2006 10:29 AM
To: [log in to unmask]
Subject: [TN] Heel Overhang

Hello again.

Question on IPC-610 (class 3) criteria.  For SMT solder joints, there appear
to be criteria set for TOE overhang, but not HEEL overhang.  Is this an
oversite or a purposeful omission?  Is there a limit on how much the heel of
an "L" shaped SMT lead can be off the pad lengthwise?  The obvious and
defined limit is "does not violate minimum electrical clearance", but does
anyone else have info on this criteria?

Thanks again,
Kevin Glidden


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