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March 2006

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Subject:
From:
Mary Jane Chism <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Mary Jane Chism <[log in to unmask]>
Date:
Mon, 6 Mar 2006 12:59:50 -0500
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Kevin,

This is one of those "cumulative" conditions where in order for you to
evaluate "heel overhang", you would need to evaluate "Side Joint Length"
and "Minimum Fillet Height".

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kevin Glidden
Sent: Monday, March 06, 2006 11:29 AM
To: [log in to unmask]
Subject: [TN] Heel Overhang

Hello again.

Question on IPC-610 (class 3) criteria.  For SMT solder joints, there
appear to be criteria set for TOE overhang, but not HEEL overhang.  Is
this an oversite or a purposeful omission?  Is there a limit on how much
the heel of an "L" shaped SMT lead can be off the pad lengthwise?  The
obvious and defined limit is "does not violate minimum electrical
clearance", but does anyone else have info on this criteria?

Thanks again,
Kevin Glidden


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