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March 2006

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Subject:
From:
Eddie Rocha <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Eddie Rocha <[log in to unmask]>
Date:
Wed, 1 Mar 2006 08:33:14 -0700
Content-Type:
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I have some questions regarding immersion silver. IPC-4553
standard refers to a thin and thick deposit silver as if
there are two different type of silver formulations. I've
spoken to multiple domestic chemical suppliers of the
silver process and they all offer the thick deposit
version. One supplier stated that they can provide a thin
deposit with their thick deposit version with no
solderability issues. The IPC standard states not to do
this.

Question 1: Why can't a thick deposit silver version be
used to deposit a thin deposit (3-5 uin)?

Question 2: Who supplies a thin deposit silver?

Question 3: Would the thin silver deposit perform better
than a thick deposit silver when press fitting pins?

Thank you,
Eddie Rocha

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