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March 2006

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Subject:
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Wed, 1 Mar 2006 08:30:25 -0600
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This is a good suggestion. You can use a few scrap boards or solder
coupons. 
The trouble is that you cannot really control the process well enough to
know you are getting consistant results because of the fact that they
are hand-soldered, and the operator/equipment/methods variability will
eventually cause a worst-case scenario. If the boards were wave-soldered
under controlled methods it could be done.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kane, Amol (349)
Sent: Wednesday, March 01, 2006 6:17 AM
To: [log in to unmask]
Subject: Re: [TN] Solder Joint Inspection

One other method to qualify the process might be to X-section 'n' boards
to determine % hole fill and draw a statistical conclusion (hypothesis
testing) that would validate the process and inspection may not be
needed

Amol Kane
M.S (Industrial Eng.)
Process Engineer
Harvard Custom Manufacturing
941 Route 38  Owego, NY 13827
Phone: (607) 687-7669 x349
[log in to unmask]

 -----Original Message-----
From:   TechNet [mailto:[log in to unmask]]  On Behalf Of John Berg
Sent:   Tuesday, February 28, 2006 1:44 PM
To:     [log in to unmask]
Subject:        Re: [TN] Solder Joint Inspection

If x-ray is not an option, you need to set up a soldering process that
would not require inspection. On a thermally relieved pad that does not
get sufficient fill, you need to preheat the pad area prior to hand
soldering to compensate for the heat sinking. If you can get a dummy
populated board, preheat it to a known reference level, and then remove
the connector body to examine the % fill. Find the minimum reference
preheat that will obtain your desired % fill. If you can't get a dummy
populated board, you can use a few production boards to find the
reference preheat by utilizing an ouitside x-ray service to determine
the % fill.

>>> [log in to unmask] 2/28/2006 7:55 AM >>>
We are having a heck of a time inspecting some solder joints and could
use your help.

Per Class 3 a solder joint is supposed to have at least a 75% fill. We
have a circuit board that has large ground planes and hand soldered
connectors that are impossible to inspect for top side solder.

We do not have access to an x-ray and are wondering if there are any
clever ways to inspect these solder joints.

Thanks,

KennyB

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