We can see this voids on solder past after assembly process and I di not
know this Solectron papers?Would you send to me?
 
Tks a lot,
 
Marcello Brett

  _____  

From: [log in to unmask] [mailto:[log in to unmask]] 
Sent: sexta-feira, 24 de fevereiro de 2006 18:26
To: TechNet E-Mail Forum; Marcello Brett Malteze
Cc: [log in to unmask]
Subject: Re: [TN] Via in Pad x Voids on Solder Process



Marcello, 
Is this voids in the solder paste after assembly or voids in the board for
the sequential laminations?  Have you seen the Solectron paper on HDI VIP
voids as a function of blind-via placement and final finish? 
Happy Holden
Asian Pacific Materials 



Marcello Brett Malteze <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]> 


02/24/2006 03:40 PM 


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Subject
[TN] Via in Pad x Voids on Solder Process

	




Hey Team,





   We are facing some problems regarding voids on Via in Pad on a 10 layers

board with sequential lamination ( 3 times inside press) on BGA area ,

someone can give me light or share your experience on this?



Board Spec:



Dielectric 2 x 106 = 90 - 100 µm final

YAG machine

O/L Copper 12 µm

Laser Diameter 130 µm

Surface finish Immersion Tin



Sometimes Voids are so big that are creating shorts under BGA.



Marcello Brett Malteze 

Mechanical Process Engineering 

Mobile: + 55 11 9468 4833 

Skype: mbrett73 





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