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March 2006

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From:
"David D. Hillman" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Thu, 2 Mar 2006 17:49:42 -0600
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Hi Steve! How thick is the pwb? Was the profile right? We typically see the
solder flow stop short of covering the pwb pad when using immersion silver
but not to the extent that your pictures showed. Did you get enough flux
applied to the pwb? The 2331 flux is pretty active and I would have thought
it would move out any oxidation that would be present from the two reflow
passes.

Dave



             Stephen Gregory
             <Stephen.Gregory@
             LABARGE.COM>                                               To
             Sent by: TechNet          [log in to unmask]
             <[log in to unmask]>                                          cc

                                                                   Subject
             03/02/2006 04:15          [TN] As long as we're talking about
             PM                        silver...


             Please respond to
              TechNet E-Mail
                   Forum
             <[log in to unmask]>
             ; Please respond
                    to
              Stephen Gregory
             <Stephen.Gregory@
               LABARGE.COM>






Hi All!



I figured as long as we're talking about silver, you might take a look
at some PTH solder joints on some boards we just built with an immersion
silver finish. I'm posting these pictures because this is the first
production board we've built here that has an ImAg finish, and I would
like to know if this appearance is pretty typical. Go check out:



http://stevezeva.homestead.com/files/Immersion_Silver_PTH.jpg



http://stevezeva.homestead.com/files/Immersion_Silver_PTH_2.jpg



This particular board went through double-sided reflow, and then the PTH
was soldered using a selective wave solder pallet while being fluxed
with an ultrasonic spray fluxer using Kester 2331ZX OA flux.



You can see that the solder didn't flow out to the edges of the pads on
the primary side of the board, the secondary side of the board looks
wonderful.  I know this is not a defect according to the -610...but is
this typical? Especially since it went through two reflow cycles?



Thanks in advance!



-Steve Gregory-







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