Not tried that one myself, couple of things though, the ultrasonic
energy is going to have to have a sideways vector to "scub away" oxides.
I am not sure if the systems normally used will do this or not.
Second point is I recall that those ultrasonic welding systems rely on a
Z axis force, and I am not sure what this will do to the shape/integrity
of your FR4 PCB.
TRY IT..............................
John
John Burke
Senior Manager - Operations , Optichron
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W: 510 249 5233
M: 408 515 4992
http://www.optichron.com
Profile: https://www.linkedin.com/e/fps/2665502/
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Rodney Miller
Sent: Friday, March 31, 2006 6:32 AM
To: [log in to unmask]
Subject: Re: [TN] Ultrasonic Weld to PCB with Ni Pads
Anyone, anyone, Bueller, Bueller....
I think this will work, but I'm interested if anyone has applied this to
PCB before?
-----Original Message-----
From: Rodney Miller [mailto:[log in to unmask]]
Sent: Wednesday, March 29, 2006 10:06 AM
To: 'TechNet '
Subject: Ultrasonic Weld to PCB with Ni Pads
I have a component with Nickel lead, a battery, and soldering/tinning it
has been troublesome.
I want to Ultrasonically Weld the leads to the PCB. Can I do this with
PCB FR4 Material. I was thinking if I cannot do it through the PCB
laminate, I might add a Via in pad and fill the via with Nickel plate.
The laminate is .030 and the finish option on the pads would be
Selective Immersion Ni, plated up to ???? 10um Maybe?
Any input appreciated....
Rodney L. Miller
Tri-onics Inc
Highland / Shanghai
Integrity and Solutions for Electronic Outsourcing
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